Thermal conductive silica gel sheet is specially produced for the design scheme of using the gap to transfer heat. It can fill the gap and complete the heat transfer between the heating part and the heat dissipation part. It has the technology and usability, and the thickness is wide and applicable, so it is a better thermal conductive filling material.

(1) Range and stability of thermal conductivity

Thermal conductive silica gel sheet can be more selective in terms of thermal conductivity, from 0.8w/k.m -... Above 3.0w/k.m, and stable performance, long-term reliable use

At present, the highest thermal conductivity of double-sided adhesive is not more than 1.0w/k-m, the thermal conductivity effect is not ideal; Thermal conductive silicon grease is a normal temperature curing process, easy to produce surface cracking, unstable performance, volatile and flow, thermal conductivity will gradually decline, not conducive to long-term reliable system operation.

(2) The structure of the process error bridging, reduce the heat sink and heat dissipation structural parts of the process error requirements

The thickness and hardness of thermal conductive silica gel sheet can be adjusted according to the different design, so in the thermal conductivity channel can bridge the heat dissipation structure, chip and other dimensions of the work error, reduce the structural design of the heat dissipation device contact surface of the work error, especially for the flatness, roughness of the work error, if improve the machining accuracy will greatly improve the product cost, Therefore, the thermal conductive silicone sheet can fully increase the contact area between the heating body and the cooling device, and reduce the production cost of the radiator.

In addition to the traditional PC industry, the new heat dissipation scheme is to remove the traditional radiator, and the structure and radiator are unified into the heat dissipation structure. When the heat dissipation chip is placed on the back of PCB layout, or in the front layout, the heat dissipation hole is opened around the chip that needs heat dissipation, and the heat is guided to the back of PCB through copper foil, etc., and then the heat conduction channel is filled with thermal conductive silicone sheet to the heat dissipation structural parts (metal bracket, metal shell) below the PCB or side, so as to optimize the overall heat dissipation structure. It also reduces the cost of the entire cooling scheme.

(3) EMC, insulation performance

Thermal conductive silicone sheet has insulation and thermal conductivity characteristics due to its material characteristics, and has good protection against EMC. Due to the silicone material, it is not easy to be pierced and torn or damaged under pressure, so the EMC has good reliability.

Due to the limitation of the characteristics of the material itself, the thermal conductivity double-sided adhesive has low EMC protection performance, which can not meet the needs of customers in many cases. In general, it can only be used when the chip itself has been insulated or the chip surface has been EMC protection.

Due to the material characteristics, the EMC protection performance of thermal conductive silicone grease is also relatively low, which can not meet customer requirements in many cases. Therefore, it is limited in use. Generally, only the chip itself is insulated or the chip surface is protected by EMC.

(4) the effect of shock absorption and sound absorption

The silicone carrier of heat-conducting silicone sheet determines that it will have good elasticity and compression ratio, so as to have good damping effect. Then adjusting the density and hardness can produce good absorption of low-frequency electromagnetic noise; The bonding mode of heat-conducting double-sided adhesive determines that it does not have the effect of shock absorption and sound absorption.

(5) Ease of installation, testing and reuse

Thermal conductive silicone sheet for stable solid, adhesive strength optional, easy to disassemble; Elastic recovery, reusable;

Once used, heat-conducting double-sided adhesive is not easy to disassemble, which may damage the chip and surrounding devices. It is not easy to disassemble thoroughly. When scraping thoroughly, will scratch the chip surface and wipe with dust, oil and other interference factors, not conducive to heat conduction and reliable protection;

The thermal conductivity grease must not be removed, and must be carefully wiped, and it is not easy to wipe thoroughly. Especially in the test of replacing the thermal conductivity medium, the reliability of the test data will be affected, thus affecting the engineers' judgment.